以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
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