The results show that LMPA curing agent has a higher reactivity and films cured by LMPA have better film properties compared to TPA.

Test results showed that when the two curing agents were added into the adhesive system within a proper ratio, the strength of the adhesive woule increase.

The distilled water resistance of this system is better than low molecular weight polyamide cured epoxy resin system. This is proved by macroscopic examination and microcosmic AFM analysis.