The relationship of Seebeck coefficient and electrical conductivity in different sintering temperatures was analyzed.
2
综述了微观尺度下利用MEMS结构测量硅材料塞贝克系数的已有工作。
The available methods of Seebeck coefficient of micro-scale material with MEMS structure were reviewed.
3
塞贝克系数随着温度的升高和Y填充分数的增加而增大,同时峰值朝低温方向移动。
Seebeck coefficient increased with increasing temperature and Y filling fraction, the maximum value of Seebeck coefficient shifted towards low temperature.