中英
填充比
/ tián chōng bǐ /
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  • 1
    同时,采用分子设计与化学制备技术制备环氧胶粘剂,具有高强高韧高填充等特点;
    Moreover, the epoxy adhesive with high intensity, high toughness and high fill factor is made by molecule design and chemical production technology.
  • 2
    根据统计的模拟结果,分析了光子晶体带隙与晶格结构、填充和本底折射率的关系。
    According to the computed results, the relationship between bandgap and lattice structure, fill ratio, refractive index of substrate is studied.
  • 3
    研究了晶格结构、填充、介电常数比三个主要因素对二维空气圆柱型光子晶体完全禁带的影响。
    The influence of three main factors such as lattice structure, packing ratio and dielectric constant ratio on complete forbidden band of 2-d air cylindrical photonic crystal is studied.
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