导电胶配方

Conductive adhesive formulation

以上为机器翻译结果，快速获取精准的人工翻译结果，建议选择有道人工翻译

1
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
2
影响铜粉导电胶导电性能和自然老化性能的主要因素是胶的配方和工艺条件，铜粉粒度。
Main factors which affect conductivity and natural aging resistance are formula. Technology and Cu powder size.

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