Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
2
从理论上讨论了铜粉丙烯酸酯胶粘剂的导电机理。
The conductive mechanism of copper powder acrylate adhesive composite was discussed.
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the con-ducting filler.
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