波峰焊工艺

Wave soldering process

以上为机器翻译结果，快速获取精准的人工翻译结果，建议选择有道人工翻译

1
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。
The wave soldering process may advance welding on the surface mount components damage.
2
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
3
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。现在很多电路板上以表面贴装元件为主。
The wave soldering process may advance welding on the surface mount components damage. Now a lot of circuit board with surface mount components.

点击反馈