电路板喷锡

Board tinning

以上为机器翻译结果，快速获取精准的人工翻译结果，建议选择有道人工翻译

1
适用于电路板喷锡，热风整平，波峰焊、热浸焊和引线搪锡。
Tin spray applied to circuit boards, hot air leveling and wave soldering, welding and hot dip tin lead anyone.
2
将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.

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