Polyamide hot melt adhesive
...聚酰胺热熔胶 [gap=7086]lectronic encapsulation;epoxy resin;polyurethane;low pressure indection molding;polyamide hot melt adhesive ...
Co-Polyamide hotmelt adhesive powder
聚酰胺热熔胶的制备方法,由二元酸直接与二元胺进行共聚聚合,再经改性、粉碎制得。