Since downtime for changeovers is an important factor in overall operating costs, the board transport system has a very substantial part to play in reducing cost per placement.

The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.

It can identify different components through visual identifying system, and mount microminiaturize flat chip with high speed and high precision, and also including subtle IC and abnormity components.