A wettability model of tin based solders is introduced and mathematical manipulation upon it is performed.
2
随着微电子表面组装技术的迅猛发展,软钎料尤其是无铅钎料逐渐成为研究的焦点。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).