That BP network used for predicting quality of wire bonding is feasible and valid.
2
分析了金丝与金导体键合的可靠性问题,总结了金丝键合失效的原因,并提出了改进的措施。
Then it analyzes the reliability problems of the bonding between spun gold and gold conductor, and proposes an improved measure after summarizing the causation of spun gold bonding fault.
3
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.