The physics teacher told us that the melting point of gold was much higher than that of tin.

Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.

The interaction between the cerium and tin in steel was studied by vacuum induction melting, Xray diffraction, optical microscopy, electronic probe microscopy analysis, and microhardness tester.