Samsung Electronics, a global leader in semiconductor and telecommunication has developed a 4gb multi-chip package (MCP) targeted at 3g mobile phones market.

三星电子公司，是全球领先的半导体和电信制定了一个4gb的多芯片封装(MCP)针对3g手机市场。

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Power consumption not only affects chip package type and cost, also causes the increase of chip temperature, which will decide the reliability of chip directly.

功耗不但直接影响芯片的封装形式与成本，而且过高的功耗将导致芯片温度的增加，直接决定着芯片的可靠性。

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The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).

SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。

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That market was also destined to end up on the commodity pile, so Endoh in 1994 assigned 50 researchers to a challenging task: Cut plastic chip package costs by one-third.

FORBES: It's all in the packaging

This circuitry will allow the microprocessor maker to replace the delicate bonding wires connecting the chip to the package with tiny balls of solder.

FORBES: It's all in the packaging

The US constitution gives Congress significant powers over purse-strings, and Republicans have said they will seek to slash funding for implementation or to chip away at the package in other ways, possibly by attaching provisions to crucial bills like the federal budget.

BBC: US elections 2010: Democratic losses and Obama's agenda