Used in silver and copper dipping process of MLCC.
板用沾银、沾铜专用胶带。
The equation for the membrane thickness controlling in hot dipping process is deduced using abridged kinetic model process.
利用简化的动态模型过程，推导热浸镀条件下的膜层厚度控制方程，并通过实验手段对此方程作了验证。
The traditional bright dipping process for aluminum and aluminum alloy was introduced, and the existing problems of the process were pointed out.
介绍了传统的铝及铝合金硝酸出光工艺，指出了该工艺存在的问题。
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