板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
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