This paper elucidates the usual technical means of the failure analysis of the electronic component and the failure phenomenon, failure mode and failure mechanism of failure electronic component.

简述了电子元器件失效分析的常用技术手段和失效元器件的失效现象、失效模式、失效机理。

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To establish and verify the failure mode, trouble reappearing and low -cycle fatigue tests are conducted on component test rigs.

为确定与验证锥齿轮故障模式，在试验器上进行故障再现试验及低周疲劳试验。

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Troubleshoot, identify failure mode and repair to component level and document relevant repair actions in details to facilitate failure analysis.

排查，确定故障和部件维修并记录维修的详细信息，以方便错误分析。

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