The research keystones of copper electroless plating were presented.
提出了化学镀铜今后的研究重点。
Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
Is there an active continuous improvement team for plating voids in the electroless copper operation?
化学沉铜是否对电镀空洞有积极的持续改善小组？
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