S-shape acceleration/deceleration(acc/dec)motion control is an important function in advanced transistor die bonder.
S曲线加减速运动控制是中高档三极管粘片机系统中的一项重要功能。
参考来源 - 三极管粘片机S曲线加减速控制Die bonder is a kind of microelectronics encapsulation device that welds transistors to the base. Temperature control system is one important part of it.
粘片机是一种将晶源焊接到底座的微电子封装设备，温度控制系统是其较为重要的组成部分。
参考来源 - 粘片机温控系统的设计与实验研究The main research of this paper is about the image processing technology system of LED automatic die bonder. The key task is determining the classification target between the qualified wafers and unqualified ones by analyzing features of image.
本文针对自动固晶机视觉系统中相关的图像处理技术展开研究,目的是获得合格晶片的准确中心坐标以及不合格晶片的缺陷类型。
参考来源 - LED自动固晶机视觉定位系统的图像处理研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Its accuracy will influence the accuracy of LED die bonder.
其精度直接影响到LED粘片的精度。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
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