The electrolytic products are hard to be removed from the small machining gap in micro ECM(electrochemical machining) process, which decrease the machining efficiency, stability and quality.
微细电解加工时，微小加工间隙内的电解产物难以移除，会降低加工效率、影响加工稳定性和质量。
The method of electrochemical micro-process based on scanning ion conductance microscopy (SICM) is developed.
提出了基于扫描离子电导显微术(SICM)的电化学微细加工方法。
The new process of electrochemical milling by rotating microelectrode like micro milling-(cutter) was proposed, and micro profiled hole and micro beam with high precision can be milled.
针对成型电极在微细加工中暴露出的缺点，提出了利用旋转微细电极像微铣刀一样进行微细电解铣削新工艺，加工出高精度型孔和悬臂梁等微结构。
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