电镀Sn-Cu合金 关键词：化学镀锡；沉积速度；工艺条件 [gap=607]Key words： Electroless tin plating；Deposition rate；Process condition
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The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
The research tendency and developing prospect of electroless tin plating are also discussed.
同时对化学镀锡的研究方向和发展趋势进行展望。
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