电镀Sn-Cu合金 关键词：化学镀锡；沉积速度；工艺条件 [gap=607]Key words： Electroless tin plating；Deposition rate；Process condition
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The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
The research tendency and developing prospect of electroless tin plating are also discussed.
同时对化学镀锡的研究方向和发展趋势进行展望。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
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