The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
The research tendency and developing prospect of electroless tin plating are also discussed.
同时对化学镀锡的研究方向和发展趋势进行展望。
应用推荐