... shoe guide plate 制动蹄导向板 filling-in procedure 填写规程 toe-in(measure along the inner rim) 前束(沿轮辋内侧测量) ...
基于182个网页-相关网页
This model adopts 24 filling heads with the double row, is mainly characterized by large capacity, after two-in-one combined convey then enter into next procedure.
该机型采用双排24头灌装，主要特点是产能大，在二合一并道输送后进入下一道工序。
The screw cap is already in place at the top of the tube and the lower end is open for the filling procedure.
螺丝盖子已经在管筒的顶部安装到位，管筒的下端开口以便于填装过程。
The procedure and mechanism of copper filling in the trench of the chip are reviewed, the effect of electrolyte components and additives on superfilling are discussed.
综述了铜在芯片微刻槽中电沉积填充的过程、机理 ，并着重讨论了实现无裂缝和无空洞理想填充的主要因素—镀液的组成和添加剂的影响。
应用推荐