flip-chip bonding 倒装芯片安装 ; 倒装晶片安装
ultrasonic flip-chip bonding 超声倒装焊
Direct flip-chip bonding 直接倒装芯片接合
Flip-Chip Bonding Technology 覆晶组装技术
flip-chip-bonding technique 倒装焊技术
Flip-chip-bonding equipment 倒装焊设备
thermosonic flip-chip bonding 热超声倒装键合
The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.
研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。
The embedded active chip also can be realized by backside thinning and flip chip bonding.
通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.
利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。
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