...镀金是解决印制板化学镀镍/置换镀金时出现黑色焊区问题的有效方法,也是取代电镀镍/电镀软金工艺用于金线键合(Gold Wire Bonding)..
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Gold Wire Bonding 它主要用于金线键合 ; 金丝键合 Copper wire bonding 铜线键合 ; 铜丝球焊 ; 铜丝引线键合 ; 铜线焊接 ..
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Fit to gold wire bonding 适合金丝键合
monitoring for gold wire bonding 金丝检测
gold thermalsonic wire-bonding 如金热声波引线接合
bonding gold wire 键合金丝
Semiconductor Gold Bonding wire 半导体键合金丝
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Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Development of these work is of benefit to raising quality of gold wire ball bonding.
这些工作的开展有利于提高金丝球焊的焊接质量。
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