After the rework treatment by the device, the wire has good surface quality and high adhesive force.
经过本装置返工处理后的钢丝，钢丝表面质量优良、粘合力高。
The results show that there is not any evidence of silver migration within LTCC construction, and conductor adhesive force, wire-bonding strength and insulation resistance are high.
结果表明：基板内部的银导体不存在迁移现象，导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。
Good performance in adhesion, High Temperature Resistance, Solvent Resistance, Strong Holding Force, No Residual Adhesive Left. For protecting gold finger in the process of PCB.
粘性佳，耐高温、耐溶剂、保持力强、不残胶。；用于印刷线路板(PCB)过锡炉喷锡和波峰焊过程中遮蔽保护金手指。
应用推荐