Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductor device and manufacturing method for the same.

金属还原方法，多层互连结构及制法，半导体器件及制法。

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A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces.

一种用于半导体发光器件的安装基板包括具有第一和第二相对金属表面的固体金属块。

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A semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).

一种半导体器件(10)，具有在最后的互连层(16)和接合焊盘之间的接触，该接合焊盘包括接合焊盘(28)和最后的互连层(16)之间的阻挡金属(26)。

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Apart from the arrival of less pricey full-frame digital SLRs, the other recent development that has impressed your correspondent is the way imaging chips are migrating from CCD (charge-coupled device) technology to CMOS (complementary metal-oxide semiconductor), used widely in the computer industry.

ECONOMIST: A die-hard analog photographer goes digital