The feasibility of the application of polyvinyl alcohol (PVA) to printed wiring board was studied.

研究了PVA在电路板印刷中的应用可行性。

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Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board.

感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法。

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Therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.

由此，得到一种层间连接部被压缩且具有高连接可靠性的多层印刷线路基板。

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