All technical indexes of the flux and the soldering paste achieve the JIS-3197 standard.

焊剂和焊膏的各项技术指标均达到JIS - 3197标准。

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Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.

回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。

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Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.

以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。

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