An introduction to the testing method for tensile and shear strength of high strength photosensitive glue is given and the main causes that have influence on the testing result is analyzed.

介绍了一种高强度光敏胶拉伸剪切强度测试方法，分析了影响测试结果的几种主要因素。

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Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.

介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。

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The effect of dynamic shear and tensile strength of tungsten heavy alloys on the fracture mode of fragmentation under explosive loading was investigated.

研究钨合金动态抗拉和抗剪强度对爆炸加载下破片宏观断裂模式的影响。

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