The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
A new comparative test approach is provided for the thermal fatigue life experiments of turbine blade under thermal shock. The tested blades and reference blades were mounted in a common vane cascade.
针对涡轮叶片的热冲击疲劳寿命实验，提出了一种新的对比实验方案和措施：将实验叶片和参照叶片组合在同一组试验叶栅上，并且在试验过程中定期对调两种叶片的安装位置。
So considering thermal aging effect to rubber may give an accurately result to predict the fatigue life.
因此，考虑热老化对材料性能的影响可能得到更准确的疲劳寿命预报。
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