基于PC总线的热分析系统在铝合金品质|专家技术频道|电子制造设备网 关键词： PC总线；热分析；铝合金；品质控制 [gap=490]Key Words: PC-Bus;Thermal alalysis;Aluminium alloy;Quality control
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emanation thermal analysis [核] 放射热分析
Differential thermal analysis DTA 差热分析 ; 差热分析法
DTA thermal analysis system DTA热分析系统
Differential Thermal Analysis 差热分析法 ; 差示热分析 ; 差热分析
thermal analysis range 热分析量程 ; 热分析范围
dynamic mechanical thermal analysis 动态力学分析 ; 动态力学热分析
differential thermal analysis curve 差热分析曲线 ; 差热曲线
thermal-analysis 热分析
By means of differential thermal analysis (DTA), curing mechanism for base coating was discussed.
借助差热分析方法，探讨了底涂的固化机理。
参考来源 - 空调亲水箔底层涂料的开发与研究By heating reflux method,zinc binary and ternary complexes were synthesized with 2,5-thiophene dicarboxylic acid and phenanthroline as ligands. Its characteristics were described by elemental analysis,infrared spectroscopy and thermal analysis.
采用加热回流的方法,以2,5噻-吩二羧酸和邻菲咯啉为配体,合成了锌的二元和三元配合物,并用元素分析、红外光谱、热重分析进行了表征。
参考来源 - 2The results of differential thermal analysis manifested that both polymers had higher thermal decomposition temperature (275℃ and 275.4℃), so the thermal stability of the polymer was fine.
热失重分析结果表明，以加热方式和微波辐射方式合成聚合物同样具有较高的热分解温度(275℃和275.4℃)，热稳定性很好。
参考来源 - NThe phase transition temperature and expansion coefficient were tested by means of thermal analysis.
用热分析仪测定了L401线材的相变点和膨胀系数。
参考来源 - 连铸L401线材及其焊接接头组织和性能In this paper, pyrolysis characteristics of saw -dust by gravitational thermal analysis under the condition of catalysts was studied, from which the saw-dust ’s thermal characteristic and reaction dynamics parameters was obtained, and the mechanism analysis was made.
用热重分析法对不同催化剂条件下木屑的热解规律进行了研究,获取了木屑热解特性和反应动力学参数,并作了机理分析。
参考来源 - 不同催化剂对木屑热解反应动力学的影响研究·2,447,543篇论文数据，部分数据来源于NoteExpress
以上来源于: WordNet
Thermal analysis is an important method for the study of material science.
热分析是研究材料科学的一种重要方法。
The results of thermal analysis show that the damage affects thermal decomposition of nitrate(NG/BTTN).
热分析试验表明，损伤对以硝酸酯为主的基体材料的热分解有影响。
To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.
为了用较小的规模模拟相对较长的金线和较大的焊盘，提出了一种温度场分析的等效方法。
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