Four die attach models have been established. Effect of voiding in the solder in die attach has been studied for the thermal conducting properties and results show that voiding has significant effect on the thermal conduction of solder joints.
对焊料贴片工艺建立了四种模型,分析了贴片工艺中焊料孔洞对器件导热性能的影响,其结果表明焊接层中的孔洞对焊接结点导热性能的影响很大。
参考来源 - MEMS器件设计、封装工艺及应用研究Regarding thermal conduction in two-dimension as emphasis, analytical solution and numerical solution of thermal conduction's process are studyed, especially the numerical solution is detailedly represented.
以二维稳态导热为重点,研究了稳态导热过程的分析解和数值解,特别对数值解进行了详细地阐述。
参考来源 - 嵌入式计算机系统热分析及热优化研究·2,447,543篇论文数据，部分数据来源于NoteExpress
以上来源于: WordNet
The thermal conduction of a composite medium with variable thermal conductivities is discussed.
讨论了可变导热系数的复合介质的导热性。
Heat can be delivered by convection, radiation, and thermal conduction.
热气可由对流、辐射和热传导来传递。
As a hydrodynamic consequence, thermal conduction results naturally in a strong shock wave.
作为热波传播的力学后果，热波自然地以强激波为终结。
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