...点形态；可靠性；热疲劳寿命 [gap=954]Keywords: Flip-chip；stencil；solder joint shape；reliability；thermal fatigue life ...
基于36个网页-相关网页
the thermal fatigue life 热疲劳寿命
thermal fatigue i life 热疲劳寿命
thermal mechanical fatigue life 热机械疲劳寿命
The Load History Fatigue Method is employed to analyse the low cycle thermal fatigue life, but this method founded on experiment and some theory bases can only obtain an approximate result, which may deviate from practice far and away.
采用基于载荷史寿命评估方法对低周热疲劳寿命进行了分析,这种方法建立在一定的假设及实验基础上,只能给出近似答案,分析结果可能会与实际有较大的偏差。
参考来源 - 汽轮机转子热应力及寿命分析·2,447,543篇论文数据，部分数据来源于NoteExpress
Low cyclic thermal fatigue life is an important parameter for evaluating the reliability of diesel engine.
热疲劳寿命是评价柴油机可靠性的一个主要指标。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
应用推荐