Meanwhile, the fillet geometry has played an important role on this thermal stress distribution.
同时，钎缝圆角几何形状对这一热应力分布有重要影响。
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
On the basis of the sheet internal temperature changes in the plate and the thermal stress distribution.
在此基础上分析了板材内外部的温度变化情况及热应力分布情况。
应用推荐