Semiconductor Gold Bonding wire 半导体键合金丝
Gold Wire Bonding 它主要用于金线键合 ; 电镀软金工艺用于金线键合 ; 金丝键合
bonding gold wire 键合金丝
gold thermalsonic wire-bonding 如金热声波引线接合
Fit to gold wire bonding 适合金丝键合
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Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Development of these work is of benefit to raising quality of gold wire ball bonding.
这些工作的开展有利于提高金丝球焊的焊接质量。
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