In this paper, the developments of molding compound and its technical requirements for O-cresol Formaldehyde Epoxy Resin, the structure and properties of O-cresol Formaldehyde Epoxy Resin, home and abroad, was briefly introduced.
本文对国内外塑封料行业的发展、塑封料对邻甲酚醛环氧树脂的技术要求及邻甲酚醛环氧树脂的结构性能进行了简要的介绍。
参考来源 - 塑封料用邻甲酚醛环氧树脂的制备·2,447,543篇论文数据,部分数据来源于NoteExpress
The sheet molding compound had an appropriate low viscosity to be molded at low pressure.
片材在模腔内有较低的粘度,适宜于低压成型。
Molding method, process, and equipment of injection molding of molding compound had been discussed in this paper.
论述了模塑料注射成型的方法、工艺、设备和模具设计方面的问题。
Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.
对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
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