A mechanism of salt groups re-distribution in film forming process was also suggested in the paper.
另外我们还提出了亲水基团在膜形成过程中重新分布的机理。
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装(CSP)进行了研究,描述了CSP的工艺流程;
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