The influencing factors on the surface activation layers during indium seal are also analyzed.
进一步分析了铟封过程中影响阴极表面激活层的因素。
Activation: the metal surface passivation state disappear role.
活化:使金属表面钝化状态消失的作用。
Weak erosion before plating, in a certain: remove metal parts in the solution of surface extremely thin oxidation film, and make the process of surface activation.
弱浸蚀:电镀前,在一定组成溶液中除去金属制件表面极薄的氧化膜,并使表面活化的过程。
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