tin-lead solder 锡铅焊料 ; 锡铅钎料
lead-tin solder 铅锡焊料
Lead-free tin-based solder 无铅锡基焊料
tin-lead d solder 锡铅焊料
tin-lead alloy solder snpb钎料
lead-free solder tin 无铅焊锡
The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.
方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.
本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。
应用推荐