In this paper, the developments of molding compound and its technical requirements for O-cresol Formaldehyde Epoxy Resin, the structure and properties of O-cresol Formaldehyde Epoxy Resin, home and abroad, was briefly introduced.
本文对国内外塑封料行业的发展、塑封料对邻甲酚醛环氧树脂的技术要求及邻甲酚醛环氧树脂的结构性能进行了简要的介绍。
参考来源 - 塑封料用邻甲酚醛环氧树脂的制备·2,447,543篇论文数据，部分数据来源于NoteExpress
在有关塑封料的湿度浸入研究中，湿气或者是穿过聚合物渗透，或者是沿着引线与密封树脂之间的界面渗透。
Moisture can penetrate either through the polymer or along the interface between the leads and the encapsulation resin in the study of moisture ingress within molding compounds of plastic pack - ages.
产品用途：高压电器件的绝缘浇注料、环氧灌封料、塑封料、包封料、绝缘子、干式变压器、高压互感器、填料等。
Uses:Packing of high tension electrical equipment, epoxy pouring packing material, plastic pacing material, dry type transformer, high tension mutual inductance equipment, insulator.
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