• The solder pad pinch of the device also decreasing rapidly.

    球尺寸减小导致焊球强度随之降低。

    youdao

  • When the first signal defect is produced, make the signal-exerting solder pad mutually short-circuit.

    产生第一信号缺陷时,使信号施加相互电短接。

    youdao

  • The effects of bending support span, solder pad size, reflow and aging history on PCB bending reliability are discussed.

    讨论了弯曲跨距、焊盘尺寸参数、以及焊点经历回流、老化等热过程PC B焊点弯曲可靠性影响

    youdao

  • The wider track provides better impedance matching at solder pad interfaces and provides better immunity to PCB manufacturing process variations.

    更宽线接口提供更好阻抗匹配PC B柔性加工过程提供更好的豁免权

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  • The static protecting line connects between the first virtual solder pad and the second virtual solder pad having a charge inducting pad which is exposed at surface of the flexible loader.

    静电防护线连接第一虚设第二虚设焊盘之间并通过 印刷电路板连接至接地端或电源端,且静电防护线上具有电荷导入暴露于软性承载器表面。

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  • The second technique involved using braided solder wick and a soldering iron with a blade tip to remove residual solder from the PCB pad.

    第二技术工艺涉及到使用网状焊料芯吸法刀片焊接烙铁除去PC B上的残余焊料。

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  • The results show that the instantaneous temperature of solder droplet when it reached the pad is mainly determined by the initial temperature.

    结果表明:对钎料到达焊盘瞬时的接触温度,熔滴初始温度主要影响因素,而高度变化其影响不大。

    youdao

  • If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.

    如果这个焊接至布线基板焊盘焊料湿柱状表面整个区域侧表面部分区域。

    youdao

  • If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.

    如果这个焊接至布线基板焊盘焊料湿柱状表面整个区域侧表面部分区域。

    youdao

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