Semiconductor film, semiconductor device and mfg. method.
半导体膜，半导体器件，和制造方法。
The SiC semiconductor device is fabricated by the method.
碳化硅半导体器件是捏造的方法。
The structure (1) is formed within a semiconductor device (5).
结构（1）在半导体装置（5）中形成。
The result is the Torrent chip, a semiconductor device that analyses genomes.
这一想法导致了Torrent芯片，一种可分析基因的半导体的诞生。
Method of surface treatment, crystal substrate, and semiconductor device.
表面处理方法，晶体基材，和半导体设备。
Circuit board, semiconductor device mfg. method, and electroplating system.
电路板，半导体装置制造方法，及电镀系统。
Provided are a semiconductor device and a method of manufacturing the same.
本发明提供一种半导体器件及其制造方法。
The invention provides a lead frame and packaging of a semiconductor device.
本发明提供一种半导体器件的引线框及封装。
It is a kind of storage device using semiconductor device as storage medium.
它是一种以半导体芯片作为存储介质的存储器。
Optical disk device, semiconductor device, optical disk and recording method.
光盘装置，半导体器件，光盘及记录方法。
The transient behavior of a semiconductor device of heat conduction is considered.
考虑热引导半导体设备中的传输行为。
Semiconductor device, and display device, driving method and electronic apparatus thereof.
半导体器件，显示器件，驱动方法及其电子装置。
An active semiconductor device with three electrodes that may be either an amplifier or a switch.
一种有源半导体器件，有三个电极，可以是放大器。
This course deals with the theory base of semiconductor physics and semiconductor device in detail.
本课程全面介绍了半导体物理及半导体器件的理论基础。
Semiconductor device, method and device for producing same, circuit board and electronic equipment.
半导体装置及其制造方法，制造装置，电路基板和电子装置。
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method.
丝焊方法，半导体器件，丝焊的毛细管及球块形成方法。
Thyristor is a high-power semiconductor device, and the standard of its rated current is temperature.
晶闸管属于大功率的半导体器件，决定其允许通过电流大小的标准之一是温度的高低。
A method of manufacturing a semiconductor device includes forming an insulation pattern over a substrate.
一种制造半导体器件的方法，包括，在衬底上形成绝缘图形。
Porous-film-forming composition, preparation method of the composition, porous film and semiconductor device.
多孔膜形成用组合物，该组合物的制备方法，多孔膜及半导体装置。
One aspect of the present invention is a method of forming a semiconductor device having copper metallization.
本发明的一个方面是形成具有铜金属化的半导体器件的方法。
This paper presents the building procedures of hydrodynamic model for submicron semiconductor device simulation.
主要讨论了亚微米半导体器件模拟的流体动力学模型方程的建立过程。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
A method is provided for testing a semiconductor device that includes both a digital (310) and analog (320) portion.
本发明提供一种用于测试包含数字部分(310)和模拟部分(320)两者的半导体装置的方法。
A semiconductor device may include a semiconductor substrate, one common gate electrode, and one gate insulating layer.
该半导体器件的一种包括半导体衬底、公共栅极电极和栅极绝缘层。
Silicone resin modified polyester(SP) is a kind of ultra-pure surface protection material used in semiconductor device.
聚酯改性硅漆（SP）是用于硅器件表面保护的高纯绝缘材料。
Voltage metering method, electric test method and device, and method for mfg. semiconductor device and device substrate.
电压测量方法，电测试方法和装置，半导体器件制造方法和器件衬底制造方法。
Semiconductor device, semiconductor device manufacturing method, high carrier mobility transistor and light emitting device.
半导体器件，半导体器件制造方法，高载流子迁移率晶体管和发光器件。
Material for insulating film, coating varnish for insulating film, and insulating film and semiconductor device using the same.
绝缘膜用材料，绝缘膜用罩光清漆，以及绝缘膜和采用该膜或该清漆的半导体装置。
Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identify of the semiconductor device.
半导体器件，卡，系统以及初始化和检验半导体器件的真实性和身份的方法。
Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identify of the semiconductor device.
半导体器件，卡，系统以及初始化和检验半导体器件的真实性和身份的方法。
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