1D- panel level fanout low cost multi-die small form factor packaging;
1D-板级扇出低成本的多晶片小外形封装；
It's also a monolithic product with a singular interface and form factor.
同时，它还是一个有着统一界面和外形的一体化产品。
However, due to physical design and form factor constraint, this is not always possible.
不过，由于物理设计和外形的限制，这并不总是可能的。
However, due to physical design and form factor constraint, this is not always possible.
不过，由于物理设计和外形的限制，这并不总是可能的。
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