The results are of importance to design and optimize of geometry shape of the solder joint.
这一结果对于焊点几何形态的设计及优化具有指导意义。
And the different section shape of the solder joint is given with the variation of solder volume.
给出了不同的钎料量对应的焊点剖面形态的变化。
So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.
因此，焊点跌落可靠性是无铅便携式电子产品可靠性的关键内容。
The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method .
分析发现，与无缺陷焊点相比，气孔使焊点中应力应变分布发生了改变，使焊点疲劳寿命缩短；
The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
The 3-d evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.
基于最小能量原理和焊点形态理论，建立了LCCC器件焊点三维形态预测模型。
Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.
对混合焊点的失效形式和混合焊点的失效机理进行了分析，并进一步介绍了影响这类焊点可靠性的因素。
The experiment results show that there is linear relationship between the solder joint creep damage and its resistance changes.
研究表明，焊点的蠕变损伤与其电阻变化存在着线性关系。
The board defect of the circuit measuring includes two parts: the solder joint defect measuring and measuring of the components and parts.
电路板缺陷检测包括两部分：焊点缺陷检测和元器件检测。
Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.
通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。
In the modern automotive industry, extensive use of spot-welding in the body, the solder joint failure is the main reason leading to vehicle failure.
在现代汽车工业中，点焊广泛运用在车身中，焊点失效是导致车身失效的主要原因。
Small solid solder joint, electrical conductivity, and no signal attenuation, when subjected to high temperature and low temperature will not fall off.
焊点细小牢靠、导电性好、无讯号衰减，在经受高温和低温时不会脱落。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
The study about board level drop impact shows that: (1) The mechanical impact and bending of PCB are the main reasons which induce the solder joint stress even the drop failure;
研究结果表明，在跌落冲击条件下：（1）PCB的机械冲击和弯曲变形是导致焊点应力甚至跌落失效的主要原因；
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Based on the procedure for parametrical optimization of MEWMA control chart, a case study of its application in surface mount process for the solder joint quality control was presented.
提出了MEWMA控制图参数优化方法，对电子产品装配中的表面贴片工艺过程的焊点质量控制进行了研究。
The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
Semiconductor analysis with ANSYS tools often incorporates nonlinear behaviors, including package warpage, solder joint creep, fracture in through-silicon-via designs, fatigue and delimitation.
利用ANSYS工具，可以分析半导体的非线性特性，其中包括封装变形、焊接点蠕变以及过孔设计中的断裂、疲劳和层间开裂。
In order to overcome the error alarming and unintelligence of the automatic optical inspection(AOI) system for the solder joint inspection, a new inspecting method based on neural network is proposed.
针对目前自动光学检测系统在进行焊点检测时容易出现缺陷误报和漏报，以及智能化程度不高的问题，提出了一种基于神经网络的检测方法。
Thermal fatigue Random variable Probabilistic analysis Solder joint Lognormal distribution;
热疲劳；随机变量；概率分析；焊点；对数正态分布；
Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.
焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.
焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
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