Finally, the cohesive zone model (CZM) was applied to simulate the damage process of solder joint under drop impact loading.
本文的研究成果为跌落冲击过程中焊锡接点数值模拟提供了必要的基础。
参考来源 - 跌落冲击载荷作用下焊锡接点的力学行为研究The thickness of oxide-film on the surface of solder joint is a main inner factor for corrosion.
焊点表面氧化膜厚度是影响腐蚀的一个最主要的内部因素。
参考来源 - SnAgCu无铅焊点水相环境腐蚀行为和预防措施的研究When the main cracks develop or join each other and the equivalent damage in solder joint grows up quickly, the electronic-resistance increases abruptly and "electronic-resistance strains - time" graph hoiks.
当主裂纹通过扩展或互相连接导致焊点损伤变得很大时，电阻具有突变的性质，“电阻应变-时间”曲线急剧上升。
参考来源 - 剪切蠕变下锡银焊点的电阻应变特性研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对这种混合焊点进行可靠性分析。
The results are of importance to design and optimize of geometry shape of the solder joint.
这一结果对于焊点几何形态的设计及优化具有指导意义。
The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
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