simulation of solder paste printing
simulation of solder paste printing
锡膏印刷的模拟
以上为机器翻译结果，长、整句建议使用 人工翻译 。
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The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。
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