... eutectic solder 共晶软焊料,易熔质焊... solder joint 焊接接缝,钎焊接头,... solder dipping 浸焊 ...
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BGA焊点可靠性研究综述_电子行业学术文章_质量学术文章_电子质量E周刊 关键词： 有限元；焊点；可靠性；BGA [gap=548]Key words: finite element;solder joint;reliability;BGA
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porous solder joint 多孔焊点
Solder Joint Reliability 焊点可靠性
Solder joint strength 关于焊点的强度 ; 焊点强度
tight solder joint 紧锡焊接头
Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对这种混合焊点进行可靠性分析。
The results are of importance to design and optimize of geometry shape of the solder joint.
这一结果对于焊点几何形态的设计及优化具有指导意义。
The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
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